2.0 mm x 2.5 mm ceramic package smd tcxo i583/i783 series ilsi america phone: 775-851-8880 ? fax: 775-851-8882? e-mail: e-mail@ilsiamerica.com ? www.ilsiamerica.com 11/07/12_b specifications subjec t to change without notice page 1 2.50+/- 0.2 2.0+/-0.2 1.1 max. 1 2 4 3 4 1 3 2 pin connection 1 vcontrol / n.c. 2 gnd 3 output 4 vcc dimension units: mm 0.6 0.5 recommended pad layout 0.10 0.10 0.6 3 4 2 1 no pattern area 1.4 2.3 2.80 product features: applications: low current consumption server & storage ultra miniature package cdma/wcdma rohs compliant 802.11 / wifi compatible with leadfree processing t1/e1, t3/e3 note: a 0.01 f bypass capacitor is recommended between vcc (p in 4) and gnd (pin 2) to minimize power supply noise. ** not available for all temperature ranges. frequency (contact sales channel for other available frequencies) output level clipped sinewave 0.8 v p-p min. output load clipped sinewave 10k ohms / 10 pf frequency stability vs temperature vs voltage vs load(5%) see frequency stability table ? 0.2 ppm max. ? .0.2 ppm max. frequency tolerance @ 25 ? c ? 2 .0 ppm (after 2 nd reflow) aging ? 1 ppm / year max. supply voltage see supply voltage table , tolerance ? current 2.0 ma max. voltage control (i783) 1.5 vdc ? 1.0 vdc, ? operating see operating temperature table storage -40 ? c to +85 ? c harmonics -8.0 dbc max. phase noise -130 dbc/hz @ 1khz part number guide sample part number: i583-5p8-26.000 mhz package operating temperature frequencystabilit y vs temperature supply voltage frequency i583 (clipped sinewave tcxo) i783 (clipped sinewave tcvcxo) 7 = 0 ? c to +50 ? c p = ? 2.0 ppm 3 = 3.3 v - 26.000 mhz 1 = 0 ? c to +70 ? c q = ? 2.5 ppm 7 = 3.0 v 3 = -20 ? c to +70 ? c r = ? 3.0 ppm 8 = 2.8 v 5 = -30 ? c to +85 ? c j = ? 5.0 ppm 2 = 2.7 v 1 = 1.8 v
2.0 mm x 2.5 mm ceramic package smd tcxo i583/i783 series ilsi america phone: 775-851-8880 ? fax: 775-851-8882? e-mail: e-mail@ilsiamerica.com ? www.ilsiamerica.com 11/07/12_b specifications subjec t to change without notice page 2 pb free solder reflow profile: typical application: *units are backward compatible with 240c reflow processes package information: msl = n.a. (package does not contain plastic, storage life is unlimited under normal room conditions). termination = e4 (au over ni over w base metalization). tape and reel information: environmental specifications thermal shock mil-std-883, method 1011, condition a moisture resistance mil-std-883, method 1004 mechanical shock mil-std-883, method 2002, condition b mechanical vibration mil-std-883, method 2007, condition a resistance to soldering heat j-std-020c, tabl e 5-2 pb-free devices (except 2 cycles max) hazardous substance pb-free / rohs / green compliant solderability jesd22-b102-d method 2 (preconditioning e) terminal strength mil-std-883, method 2004, test condition d gross leak mil-std-883, method 1014, condition c fine leak mil-std-883, method 1014, condition a2, r1=2x10-8 atm cc/s solvent resistance mil-std-202, method 215 marking line 1: xxxx(freq.code,production code,year, month,date) (example=?gb17l?) line 2: xxxxx (crystal code) quantity per reel 3000 a 8 +/-.3 b 4 +/-.2 c 3.5 +/-.2 d 9 +/-1 or 12 +/-3 e 60 / 80 f 180
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